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Key Highlights

  • Over 100,000 employees globally
  • Headquartered in Mountain View, California
  • Parent company Alphabet Inc. valued at $1.5 trillion
  • Google Cloud Platform serves millions of customers

Google LLC, headquartered in Mountain View, California, is a global leader in internet-related services and products, including its flagship search engine, Google Search, and the Android operating system. With over 100,000 employees, Google also offers cloud computing services through Google Cloud P...

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Google offers competitive salaries, equity options, generous PTO policies, comprehensive health benefits, and a remote work policy that allows flexibi...

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Google is known for its engineering-first culture, emphasizing innovation and collaboration. The company fosters a unique environment that encourages ...

Google

Hardware Engineer Mid-Level

GoogleGoleta - On-Site

Posted 2w ago🏛️ On-SiteMid-LevelHardware Engineer📍 Goleta💰 $147,000 - $216,000 / yearly
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Overview

Google is hiring an Advanced Packaging Development Engineer to contribute to the research and development of next-generation packaging platforms for quantum processors. You'll work with advanced packaging technologies and collaborate with cross-functional teams. This position requires 3 years of relevant experience.

Job Description

Who you are

You have a Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field such as Optics or Sensors. With at least 3 years of experience developing advanced packaging solutions, you have a solid foundation in delivering R&D concepts to released products. Your expertise includes working with technologies like 2.5D/3D integration, wafer-level packaging, and hybrid bonding, making you well-equipped for this role.

You possess a Master's degree or PhD in a related field, which enhances your understanding of advanced packaging technologies. Your experience using simulation tools to evaluate electrical, thermal, or mechanical performance of packaging structures is a significant asset. Familiarity with quantum computing hardware architectures and their constraints on packaging design further strengthens your qualifications.

What you'll do

As an Advanced Packaging Engineer, you will play a crucial role in the research and development of next-generation packaging platforms for superconducting quantum processors. Your focus will be on pioneering and investigating packaging methods, including advanced substrate materials and novel interconnect technologies. You will collaborate closely with the quantum processor team, RF engineers, and external partners to transition research into practical applications.

Your responsibilities will include developing and documenting new process flows and Design-For-Integration (DfI) principles for emerging technologies. You will investigate and characterize the electrical, thermal, and mechanical properties of advanced packaging materials, ensuring that they meet the rigorous demands of quantum computing applications. Your work will be instrumental in evaluating, co-developing, and qualifying next-generation packaging processes and components, pushing the boundaries of current manufacturing standards.

What we offer

At Google, you will be part of a team that is at the forefront of quantum technology. We offer a collaborative environment where innovation thrives, and your contributions will directly impact the future of computing. You will have access to cutting-edge resources and the opportunity to work alongside some of the brightest minds in the industry. We encourage you to apply even if your experience doesn't match every requirement, as we value diverse perspectives and backgrounds.

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