Hardware Engineer • Mid-Level

Who you are

You have a Bachelor's degree in a relevant field and at least 3 years of experience in the industry, specifically in silicon photonics and optical packaging. Your background includes working with optical I/O module architecture and assembly processes, showcasing your ability to innovate in high-volume, low-cost applications. You are familiar with optical coupling design and have experience collaborating with cross-functional teams to drive technology development.

Your expertise in optical engineering allows you to lead projects effectively, ensuring that optical engine modules and fiber array connectors are designed for optimal performance and reliability. You are comfortable working with vendors and foundries to bring packaging solutions from concept to high-volume manufacturing, demonstrating your ability to manage complex projects.

You possess strong problem-solving skills and a keen attention to detail, which are essential for characterizing micro-optical components and ensuring that all designs meet stringent performance criteria. Your ability to communicate effectively with team members and stakeholders is crucial in this highly visible role, where collaboration is key to success.

Desirable

A Master's or Ph.D. in Physics with a focus on optics is preferred, as it would enhance your understanding of the underlying principles of silicon photonics. Experience with international travel for project collaboration is a plus, as you may need to engage with global partners in the optical component supply chain.

What you'll do

In this role, you will lead the development of silicon photonics packaging technology, focusing on creating innovative solutions for optical interconnects. You will define assembly baseline processes and decide on the bill of materials for packaging, ensuring that all components are optimized for performance, reliability, yield, and cost. Your responsibilities will include establishing optical coupling designs and manufacturing processes that meet the high standards expected at Apple.

You will work closely with cross-functional teams, including engineering, manufacturing, and supply chain, to drive the development of optical engine modules and co-packaging optics. Your leadership will be essential in guiding the team through the complexities of silicon photonics packaging, from initial concept through to high-volume manufacturing.

You will also engage with optical component vendors and foundries to ensure that the packaging solutions you develop are feasible and scalable. Your role will involve characterizing micro-optical components and driving the integration of these components into the overall packaging architecture.

What we offer

Apple provides a dynamic work environment where innovation is at the forefront. You will have the opportunity to work on cutting-edge technology that is shaping the future of optical interconnects. We offer competitive compensation and benefits, along with opportunities for professional growth and development. Join us in our mission to create groundbreaking technology that enhances connectivity and performance in data centers and beyond.