Ic Package Design Engineer • Mid-Level

Who you are

You have a strong background in IC package design, with experience in implementing physical designs for SoC, Memory, RF, and cellular chips. Your attention to detail and commitment to excellence enable you to drive extraordinary results in your work. You thrive in collaborative environments, interfacing with multi-functional groups to analyze feasibility and optimize package designs. Your technical skills include defining design verification strategies and ensuring compliance with SI/PI requirements. You are adept at performing extraction of S-parameters and package RLGC models, contributing to the overall success of the projects you work on.

What you'll do

In this role, you will own and drive the package selection process, focusing on new generation product package structures and configuration optimization. You will be responsible for the physical design and layout of packages and modules, ensuring they meet the necessary mechanical, electrical, and thermal performance standards. You will collaborate with various teams across Apple to conduct feasibility analyses and design optimizations. Your responsibilities will also include developing automation strategies to streamline package design and release flows, as well as optimizing package pinouts to enhance performance. You will play a critical role in driving the design process from concept to manufacturing, ensuring that all designs meet the highest standards of quality and performance.

What we offer

At Apple, you will be part of a team that values innovation and excellence. We offer a dynamic work environment where your contributions will have a direct impact on the development of cutting-edge consumer electronics. You will have the opportunity to work with some of the brightest minds in the industry, collaborating on projects that push the boundaries of technology. We provide competitive compensation and benefits, along with opportunities for professional growth and development within the company.