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- Market cap of $3 trillion as of 2022
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Apple Inc. (NASDAQ: AAPL), headquartered in Cupertino, CA, is the world's most valuable company with a market capitalization of $3 trillion as of 2022. Known for its iconic products such as the iPhone, iPad, and Mac, Apple serves over 1 billion active devices globally. The company has a strong commi...
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Apple offers comprehensive medical plans covering physical and mental healthcare, paid parental leave, and a gradual return-to-work program. Employees...
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Ic Packaging Integration Engineer • Senior
Apple • Santa Clara - On-Site
Overview
Apple is hiring an IC Packaging Integration Engineer to lead SoC package integration and architecture efforts. You'll work on advanced packaging technologies and collaborate with cross-functional teams. This position requires 10+ years of experience in the semiconductor packaging industry.
Job Description
Who you are
You have a Bachelor's degree and over 10 years of experience in the semiconductor packaging industry, showcasing your expertise in IC packaging development. Your attention to detail and commitment to excellence drive you to achieve extraordinary results in your work. You possess a deep understanding of multi-functional packaging areas, including package layout and architecture, enabling process technologies, and system-level reliability. Your problem-solving skills are complemented by a strong foundation in physics and engineering principles, allowing you to tackle complex challenges effectively.
You are experienced in advanced packaging technologies such as FOWLP, 2.5D, and 3D, and you have the knowledge to deliver high-density and high-performance interconnects while considering thermo-mechanical reliability and cost constraints. Your excellent communication skills enable you to work collaboratively with cross-functional teams, leading integration and architecture efforts for SoC packages. You thrive in environments that encourage innovation and are eager to contribute to groundbreaking technologies that enable new products.
What you'll do
In this role, you will be responsible for the development of IC packaging solutions, working closely with cross-functional teams to lead SoC package integration and architecture efforts. You will drive the industry forward by developing advanced package solutions and new material developments, ensuring that specifications meet the highest standards. Your role will involve collaborating with various teams to ensure that packaging solutions align with product requirements and performance expectations.
You will also focus on improving yield and reliability through rigorous testing and analysis, utilizing your expertise to identify areas for enhancement. Your contributions will play a crucial role in the successful integration of packaging technologies into Apple's innovative products. You will be expected to stay updated on industry trends and advancements, applying this knowledge to enhance Apple's packaging capabilities and maintain its competitive edge.
What we offer
Apple offers a dynamic work environment where innovation is at the forefront of everything we do. You will have the opportunity to work on cutting-edge technologies that shape the future of consumer electronics. We value diversity and inclusion, fostering a culture where every employee can thrive and contribute to our mission of delivering extraordinary products and experiences. Join us and be part of a team that is dedicated to pushing the boundaries of technology and creating impactful solutions for our customers.
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