
About Apple
The personal technology company redefining user experience
Key Highlights
- Market cap of $3 trillion as of 2022
- Over 1 billion active devices worldwide
- Comprehensive medical plans including mental healthcare
- Paid parental leave and gradual return-to-work program
Apple Inc. (NASDAQ: AAPL), headquartered in Cupertino, CA, is the world's most valuable company with a market capitalization of $3 trillion as of 2022. Known for its iconic products such as the iPhone, iPad, and Mac, Apple serves over 1 billion active devices globally. The company has a strong commi...
🎁 Benefits
Apple offers comprehensive medical plans covering physical and mental healthcare, paid parental leave, and a gradual return-to-work program. Employees...
🌟 Culture
Apple's culture emphasizes an obsessive focus on user experience and consumer privacy, setting it apart from competitors. The company promotes inclusi...
Skills & Technologies
Overview
Apple is seeking a Lead Hardware Engineer to drive package integration and architecture efforts in semiconductor packaging. You'll work with cross-functional teams to bring innovative packaging solutions from concept to mass production. This role requires 10+ years of relevant industry experience.
Job Description
Who you are
You have over 10 years of relevant industry experience in semiconductor packaging, showcasing your expertise in packaging design and technology development. Your attention to detail and commitment to excellence enable you to work towards extraordinary results in groundbreaking technologies. You possess strong managerial skills, allowing you to lead cross-functional teams effectively and drive package integration efforts.
Your understanding of cross-functional packaging areas, including Si floor plan, package layout, and architecture, is complemented by your knowledge of enabling process technologies. You are well-versed in thermal, mechanical, SI/PI, material, component, and system-level reliability, testing, and failure analysis. Your insight into advanced packaging technologies equips you to deliver high-density and high-performance interconnects in various form factors.
Desirable
Experience with innovative packaging solutions from concept to high-volume manufacturing is highly desirable. You have a good grasp of the industry standards and specifications that drive advanced packaging solutions. Your ability to collaborate with third-party vendors and OSATs is crucial for bringing packaging solutions to life.
What you'll do
In this role, you will lead package integration and architecture efforts, working closely with cross-functional teams to ensure successful project execution. You will be responsible for driving the development of innovative packaging solutions from concept to mass production, ensuring that all specifications and requirements are met. Your role will involve collaborating with third-party vendors and OSATs to bring packaging solutions from concept to high-volume manufacturing.
You will oversee the integration of various packaging technologies, ensuring that they align with Apple's high standards for quality and performance. Your leadership will be essential in guiding your team through the complexities of semiconductor packaging, fostering an environment of collaboration and innovation.
What we offer
Apple offers a dynamic work environment where your contributions will have a significant impact on the development of groundbreaking technologies. You will have the opportunity to work with some of the brightest minds in the industry, collaborating on projects that push the boundaries of what is possible. We encourage you to apply even if your experience doesn't match every requirement, as we value diverse perspectives and backgrounds.
Join us at Apple, where your passion for excellence and innovative thinking will be rewarded with opportunities for professional growth and development. We are committed to fostering an inclusive and diverse workplace, ensuring that all employees feel valued and empowered to succeed.
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