Hardware Engineer • Senior

Who you are

You have a BS and 10+ years of experience in the semiconductor packaging industry, with a strong background in package integration and technology development. You thrive on solving complex technical problems and hold yourself to a high standard of engineering excellence. Your experience includes silicon fab interconnect process integration, and you possess deep knowledge of electrical, mechanical, and thermal properties of fab materials. You are self-motivated and comfortable navigating ambiguity, making you an ideal fit for a role that requires innovative thinking and collaboration with cross-functional teams.

Desirable

A PhD and 6+ years of relevant industry experience would be preferred, along with expertise in advanced packaging for groundbreaking CMOS nodes. Familiarity with electrical, mechanical, and thermal characterization, as well as failure design decisions, will set you apart in this role.

What you'll do

In this role, you will contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You will work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production. Your responsibilities will include developing advanced packaging technologies in a cross-functional team, focusing on package integration and technology development. You will also be involved in analyzing yield and reliability mechanisms, ensuring that the packaging solutions meet Apple's high standards for performance and quality.

What we offer

Apple is committed to fostering an inclusive and diverse workplace. You will have the opportunity to work on cutting-edge technology that impacts millions of users worldwide. We encourage you to apply even if your experience doesn't match every requirement, as we value curiosity and a growth mindset. Join us in shaping the future of technology and making a difference in the world.