Hardware Engineer • Mid-Level

Who you are

You have a Bachelor's degree and at least 3 years of relevant industry experience in substrate technology and manufacturing processes. Your in-depth knowledge of substrate technology, design rules, and roadmap development sets you apart. You possess hands-on experience in substrate manufacturing and technology development, including Cu plating, lithography, dielectric materials, via formation, solder resist, and surface finishes. Familiarity with package assembly and integration processes is preferred, and you have experience using Cadence Allegro platform tools for design review for manufacturing (DFM).

What you'll do

In this role, you will own and drive sophisticated package selection and new-generation package structure optimization. You will lead the development of SoC package substrate technology, defining the roadmap and collaborating with cross-functional teams to achieve optimal package performance. Your responsibilities will include working with substrate manufacturing industry partners, foundries, and OSAT to bring package substrate solutions from concept to high-volume manufacturing (HVM). You will drive the industry with sophisticated package solutions, new architectures, material and process development, and specification definitions. Expect to engage in 5% international travel as part of your role.

What we offer

At Apple, you will be part of a team that is committed to innovation and excellence in hardware technology. We offer a collaborative work environment where your contributions will directly impact the development of cutting-edge consumer electronics. You will have opportunities for professional growth and development, working alongside some of the brightest minds in the industry. Join us in shaping the future of technology and making a difference in the lives of millions of users worldwide.