Hardware Engineer • Senior

Who you are

You have a Bachelor's degree and over 10 years of relevant industry experience, with a strong foundation in material, chemistry, or mechanical engineering. Your in-depth knowledge of substrate technology, manufacturing processes, and design rules sets you apart in the field. Hands-on experience in substrate manufacturing and technology development is essential, particularly with Cu plating, lithography, dielectric materials, via formation, solder resist, and surface finishes. Familiarity with package assembly and integration processes is preferred, and you have experience using Cadence in your development cycle.

What you'll do

In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure, and configuration optimization. You will be responsible for Apple package substrate, including design, technology, manufacturing, reliability, and future roadmap. Collaborating with cross-functional teams, you will work to achieve the best package performance. Your responsibilities will include leading SoC package substrate technology development, pathfinding, and roadmap definition. You will engage with the substrate manufacturing industry, foundries, and OSAT to bring package substrate solutions from concept to high-volume manufacturing. Additionally, you will drive the industry with sophisticated package solutions, new architecture, material and process development, and specification definitions. Expect to travel internationally about 5% of the time.

What we offer

At Apple, you will be part of a team that invents and designs cutting-edge electronic packaging solutions for our consumer electronic products. We encourage you to apply even if your experience doesn't match every requirement, as we value diverse perspectives and backgrounds. Join us in shaping the future of technology and making a significant impact on the products that millions of people use every day.