Chip Packaging Technologist • Senior

Who you are

You hold a Bachelor's degree in Materials, Mechanical, or Electrical Engineering, or a related field, and have accumulated at least 5 years of experience working with 3D packaging technologies. Your background includes significant experience collaborating with foundries and OSATs for package development, showcasing your ability to navigate complex manufacturing environments. You have a strong understanding of multidisciplinary interactions between packaging technology, chip package electrical design, thermal and mechanical performance, and manufacturability/reliability. Your knowledge extends to advanced substrate technologies for high-performance computing applications, as well as the general package assembly process and reliability requirements at both component and board levels.

You are driven by innovation and have experience in developing new technologies that push the boundaries of chip packaging. Your expertise in managing assembly houses or wafer foundries has equipped you with the skills necessary to oversee complex projects and ensure successful outcomes. You thrive in collaborative environments, working closely with product architects, SI/PI, Thermal/Mechanical, Assembly, and PCB engineers to create high-performance packages that meet the demands of cutting-edge technology.

What you'll do

As a Chip Packaging Technologist on the silicon integration team, you will be responsible for developing advanced packaging solutions, specifically focusing on 2.5D, 3D, and 3.5D technologies for Machine Learning chips. Your role will involve collaborating with various engineering teams to optimize package performance, ensuring that the designs meet both technical specifications and reliability standards. You will proactively identify packaging risks and document technical risk assessments for test vehicle definitions, working with foundries and OSATs to develop and execute engineering plans and test vehicles.

You will define and implement DFx methodologies (DFM, DFR, DFT) for advanced packages, driving collaboration with multi-functional internal teams, OSATs, and material suppliers to deliver innovative chip package solutions. Your contributions will directly impact the next generation of hardware experiences, enhancing the performance and efficiency of Google's direct-to-consumer products. You will be part of a diverse team that is committed to pushing boundaries and developing custom silicon solutions that power the future of technology.

What we offer

At Google, you will be part of a culture that values innovation and collaboration. You will have the opportunity to work on projects that have a significant impact on the technology landscape, contributing to products that are loved by millions worldwide. We encourage you to apply even if your experience doesn't match every requirement, as we believe diverse teams build better products. You will have access to resources and support that will help you grow in your career, as well as the chance to work with some of the brightest minds in the industry.