Google

About Google

Empowering the world through technology and information

🏢 Tech👥 100K+📅 Founded 1998📍 Mountain View, California, United States

Key Highlights

  • Over 100,000 employees globally
  • Headquartered in Mountain View, California
  • Parent company Alphabet Inc. valued at $1.5 trillion
  • Google Cloud Platform serves millions of customers

Google LLC, headquartered in Mountain View, California, is a global leader in internet-related services and products, including its flagship search engine, Google Search, and the Android operating system. With over 100,000 employees, Google also offers cloud computing services through Google Cloud P...

🎁 Benefits

Google offers competitive salaries, equity options, generous PTO policies, comprehensive health benefits, and a remote work policy that allows flexibi...

🌟 Culture

Google is known for its engineering-first culture, emphasizing innovation and collaboration. The company fosters a unique environment that encourages ...

Overview

Google is hiring a Chip Packaging Technologist to lead the development of chip packaging technologies. You'll work with materials and assembly processes to optimize semiconductor packaging. This position requires 5+ years of experience in packaging and foundry interactions.

Job Description

Who you are

You have a Bachelor's degree in Materials, Mechanical, or Electrical Engineering, or a related field, along with 5 years of experience in 3D packaging. Your background includes working with foundries and OSATs for package development, showcasing your expertise in semiconductor package manufacturing and yield optimization. You are knowledgeable about the general package assembly process, packaging materials, and reliability requirements, and you have experience managing assembly houses or wafer foundries. Your understanding of 2.5D and 3D packaging technologies, particularly for High Performance Computing (HPC) applications, sets you apart. You are adept at navigating multidisciplinary interactions between packaging technology, chip package electrical design, thermal and mechanical performance, and manufacturability/reliability.

What you'll do

In this role, you will direct all technical aspects of package design, assembly processes, package materials, and reliability tests. You will perform early feasibility studies using test vehicles and create specifications to guide the development process. Your collaboration with multi-functional internal teams, Outsourced Assembly and Tests (OSATs), and material suppliers will be crucial in delivering chip package solutions for production. You will drive foundry technologies to package interactions and define and implement Design for Excellence methodologies, including Design for Manufacturability, Design for Reliability, and Design for Testing for advanced packages. Your contributions will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration in Google's products.

What we offer

At Google, you will be part of a diverse team that pushes boundaries and develops custom silicon solutions that power the future of direct-to-consumer products. You will have the opportunity to contribute to innovation that impacts millions of users worldwide. We encourage you to apply even if your experience doesn't match every requirement, as we value diverse perspectives and backgrounds. Join us in shaping the future of technology and making a difference in the world.

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