Other Technical Roles

Who you are

You have experience operating and programming dicing equipment, including diamond saws and laser dicers — you understand the intricacies of silicon wafer processing and have a keen eye for detail to ensure quality and reliability in production. Your background includes developing and refining dicing recipes, adjusting parameters to achieve optimal results — you thrive in environments where precision and efficiency are paramount. You enjoy collaborating with engineers and leadership to solve complex problems and contribute to innovative projects that have a significant impact on technology and connectivity.

What you'll do

In this role, you will operate and program various dicing equipment, performing full-cut, partial-cut, or scribe-and-break processes on silicon wafers and large-format panels. You will develop and refine dicing recipes by adjusting parameters such as blade speed, coolant flow, and laser power to achieve clean edges and minimize die strength loss. Your work will directly contribute to the success of the Starlink satellite constellation, ensuring that the products delivered meet the highest standards of quality and manufacturability. You will collaborate closely with IC packaging engineers and test engineers to troubleshoot and optimize processes, making a tangible impact on the development and manufacturing of cutting-edge technology.

What we offer

At SpaceX, you will be part of a mission-driven team focused on enabling human life on Mars and providing reliable internet to the world through the Starlink project. We offer competitive compensation and benefits, along with opportunities for professional growth and development in a fast-paced, innovative environment. Join us in our quest to revolutionize space technology and connectivity.